Working towards Ph.D. in Materials Engineering
Sc.M. in Materials Science (2018)
Sc.B. with Honors in Materials Engineering (2017)
The Chinese University of Hong Kong
International Asia Studies Program, Fall 2015
Copyright © Andrew Hitt. All rights reserved.
Tin Whisker Kinetics in Thin Films
PI: Prof. Eric Chason, School of Engineering
Publication: E. Chason, J. Vasquez, F. Pei, N. Jain and A. Hitt (2018). “Quantifying the Effect of Stress on Sn Whisker Nucleation Kinetics,” Journal of Electronic Materials 47(1): 103-109.
Corporate Social Media and Employment Networks
PI: Prof. Lynn Wu, Wharton School of Business
University of Pennsylvania
Materials Science and Engineering
Computer Science and Applied Math